H353 WiFi / BLE Module
Nkọwapụta ngwaahịa
802.11b/g/n/ax 1T1R WiFi/BLE Module
(Q353233N1100)
Ụdị Ver1.0
Akụkọ ihe mere eme
| Mwepụta akwụkwọ | Ụbọchị | Mgbanwe | Mmalite | Ekwenyere |
| Ụdị V1.0 | 2/5/2025 |
gafereview
Q353233N1100 is a highly integrated 2.4GHz low-power SoC WiFi and BLE Combo chip that integrates IEEE
802.11b/g/n/ax baseband and RF circuits. The RF circuit includes power amplifier PA, obere mkpọtụ amplifier LNA, RF BALUN, TX/RX
Switch, and power management modules; Supports 20MHz/40MHz bandwidth and provides a maximum physical layer rate of 150Mbps.
Q353233N1100 WiFi baseband na-akwado teknụzụ Orthogonal Frequency Division Multiple Access (OFDMA), teknụzụ Orthogonal Frequency Division Multiplexing (OFDM), yana azụ azụ dakọtara na Direct Sequence Spread Spectrum (DSSS) na teknụzụ Mmekọ Keying (CCK). Ọ na-akwado ọnụego data dị iche iche nke IEEE 802.11b/g/n protocol yana ọnụego MCS0-MCS9 nke IEEE 802.11ax protocol.
Q353233N1100 supports BLE 1MHz/2MHz bandwidth, BLE 4.0/4.1/4.2/5.0/5.1/5.2/5.3 protocols, BLE Mesh function, and a maximum air interface rate of 2Mbps.Q353233N1100 integrates a dual core high-performance 32-bit microprocessor, hardware security engine, and rich peripheral interfaces, including SDIO, SPI, QSPI, UART, I2C, I2S, PWM, GPIO, and multi-channel ADC; The chip has built-in SRAM and Flash, which can run independently and support running programs on Flash. Q353233N1100 supports Open Harmony and third-party components, and provides an open and easy-to-use development and debugging environment. Q353233N1100 is suitable for IoT intelligent terminal fields such as smart door locks, smart doorbells, battery cameras, etc
Isi nkọwa
WiFi
- 1X1 2.4GHz frequency band
- PHY supports IEEE 802.11b/g/n/ax
MAC supports IEEE 802.11d/e/i/k/v/r/w - Supports 802.11n 20MHz/40MHz bandwidth, supports 802.11ax 20MHz bandwidth
- Maximum supported speed: 150Mbps@HT40 MCS7，114.7Mbps@HE20 MCS9
- Built in PA and LNA, integrated TX/RX Switch, Balun, etc
- Supports both STA and Soft AP forms, with a maximum support of 4 STAs when used as Soft AP
- Support A-MPDU A-MSDU
- Support QoS to meet the quality of service requirements of different businesses
- Support WPA/WPA2/WPA3 personal, WPS2.0
- Support RF self calibration scheme
- Support STBC and LDPC
- Ịnye ọkụ voltage ntinye nso: VBAT=3.3V, VDDIO ike ọkọnọ voltage supports 1.8V and 3.3V
- Oriri ike dị ala:
Ọnọdụ ụra miri emi: 16 uA @ 3.3V
DTIM10: 98uA@3.3V
*Test conditions: The ambient temperature is 25 ℃, the RX reception time is 1mS, and the chip is powered by Buck and tested under shielded environmental conditions.
Bluetooth
- Bluetooth Low Energy (BLE）
- Supports speeds of 125Kbps, 500Kbps, 1Mbps, and 2Mbps
- Supports Class 1 Class 2
- Supports maximum power of 14dBm and BLE Mesh
- Support BLE Mesh
- Supports BLE 4.0/4.1/4.2/5.0/5.1/5.2/5.3 CPU subsystem
CPU subsystem
- High performance 32-bit microprocessor with a maximum operating frequency of 120MHz
- Embedded SRAM 576KB ROM 352KB
- Embedded 4MB Flash
- Embedded 2KB eFuse
mpụta interface
- 1 SPI interface, 1 QSPI interface, 2 I2C interfaces, 1 I2S interface, 3 UART interfaces, 1 SDIO 2.0 interface, 28 GPIO interfaces, 8 ADC inputs, 8 PWM inputs, external 32K clock (mara: the above interfaces are implemented through multiplexing)
Ozi ndị ọzọ
- Working temperature:- 40℃～ 85℃
Isi atụmatụ nke ngwọta
Stable and reliable communication capability
- Support reliable communication algorithms such as TPC, automatic rate, and weak interference immunity in complex environments
Flexible networking capability
- Support BLE Mesh networking
- Supports Wi Fi and BLE networking methods
Comprehensive network support
- Support IPv4/IPv6 network functionality
- Supports DHCPv4/DHCP v6 Client/Server
- Support DNS Client functionality
- Support mDNS function
- Support CoAP/MQTT/HTTP/JSON basic components
Powerful security engine
- Hardware implementation of AES128/256 encryption and decryption algorithm
- Hardware implementation of HASH-SHA256 and HMAC-SHA256 algorithms
- Hardware implementation of true random number generation, meeting FIPS140-2 random testing standards
- Hardware supports TLS/DTLS acceleration
- Hardware implementation of RSA and ECC signature verification algorithms
- Hardware supports national encryption algorithms SM2, SM3, SM4
- Internally integrated EFUSE, supporting secure storage, secure boot, and hardware ID
- Internally integrated MPU feature, supporting memory isolation feature
Open Operating System
- Supports operating systems such as Open Harmony and Free RTOS, providing an open, efficient, and secure system development and runtime environment
- Provide flexible protocol support and scalability
- Provide multi-level development interfaces: operating system adaptation interface and system diagnostic interface, link layer interface, network layer interface
Complete product solutions
- Support integration with mainstream control chips and provide dual machine communication components
Nha modul（Units: mm）(Dimensional tolerance ± 10%)
Mara: The height with shielding cover is 2.2 ± 0.2mm, and the overall height of the module without shielding cover is 1.8 ± 0.2mm.
Nkọwa pin modul
Ihe ntụtụ uhie (3) ndị a bụ ntụtụ nhazi ngwaike nke enweghị ike ịdọrọ, na modul enweghị ike ịdị n'ogo dị elu mgbe agbanyere ya.
Enwere ike ịhazi atụdo (5) na-acha anụnụ anụnụ ka ọ bụrụ ihu na ọkwa kpalitere n'ụra n'ụra ụra. Ụra miri emi enweghị ike ịpụta ọkwa dị elu na nke dị ala.
Enwere ike ịhazi atụdo (5) na-acha anụnụ anụnụ ka ọ bụrụ ihu na ọkwa kpalitere n'ụra n'ụra ụra. Ụra miri emi nwere ike ịpụta ọkwa dị elu na nke dị ala.
| Ntụtụ | Ọrụ | Ụdị | Voltage | Nkọwa |
| 1 | GND | GND | - | GND pin |
| 2 | ANT | ORF | - | WiFi/BLE RF input and output |
| 3 | GND | GND | - | GND pin |
| 4 | MIO_08 | I/O | VDDIO | MIO_08 |
| 5 | MIO_11,（Udsleep） | I/O | VDDIO | MIO_11/SPI0_CLK/I2S_BCLK |
| 6 | MIO_12 | I/O | VDDIO | MIO_12/SPI0_DI/I2S_DI, |
| 7 | MIO_13/SDIO_INT | I/O | VDDIO | MIO_13/SPI0_DO/I2S_DO |
| 8 | MIO_10 | I/O | VDDIO | MIO_10/SPI0_CS0/I2S_WS |
| 9 | VBAT | IPMU | 3.3V | Ntinye ike VABT |
| 10 | MIO_14 | I/O | VDDIO | MIO_14 |
| 11 | MIO_09 | I/O | VDDIO | MIO_09 |
| 12 | Tụgharịa | IANA | VDDIO | Chip reset pin (low level reset) |
| 13 | MIO_15/SOC_PWCTL | I/O | VDDIO | SOC_PWCTL master SoC power control pin |
| 14 | MIO_00/SDIO_D2 | I/O | VDDIO | MIO_00/SDIO_D2/BAT_DET |
| 15 | MIO_01/SDIO_D3,（Udsleep） | I/O | VDDIO | MIO_01/SDIO_D3/BAT_STA |
| 16 | MIO_02/SDIO_CMD | I/O | VDDIO | SDIO Command In |
| 17 | MIO_03/SDIO_CLK | I | VDDIO | SDIO CLK |
| 18 | MIO_04/SDIO_D0 | I/O | VDDIO | SDIO Data0, single-wire SDIO data line pin |
| 19 | AIO_05/SDIO_D1,（Udsleep） | I/O | VDDIO | USB_DET, USB insertion detection |
| 20 | GND | GND | - | GND pin |
| 21 | MIO_06,（Udsleep） | I/O | VDDIO | MIO_06 |
| 22 | VDDIO | IPMU | VDDIO | IO power supply, all IO level select pins, supports 1.8V and 3.3V |
| 23 | MIO_22 | I/O | VDDIO | MIO_22 |
| 24 | RTC_OUT | O | - | Modul mpụga 32.768KHz kristal |
| 25 | RTC_IN | I | - | Modul mpụga 32.768KHz kristal ma ọ bụ ntinye akara 32.768KHz nwere njedebe. |
| 26 | MIO_21 | I/O | VDDIO | MIO_21 |
| 27 | MIO_17/QSPI1_CLK/I2S_BCLK | I/O | VDDIO | MIO_17/QSPI1_CLK/I2S_BCLK |
| 28 | MIO_18/QSPI1_D0/I2S_DO | I/O | VDDIO | MIO_18/QSPI1_D0/I2S_DO |
| 29 | MIO_19/QSPI1_D1/I2S_DI | I/O | VDDIO | MIO_19/QSPI1_D1/I2S_DI |
| 30 | MIO_20/QSPI1_CS/I2S_WS | I/O | VDDIO | MIO_20/QSPI1_CS/I2S_WS |
| 31 | GND | GND | - | GND pin |
| 32 | MIO_07/QSPI1_D2（, Udsleep） | I/O | VDDIO | MIO_07/QSPI1_D2 |
| 33 | GND | GND | - | GND pin |
| 34 | MIO_16/QSPI1_D3（, Udsleep） | I/O | VDDIO | MIO_16/QSPI1_D3 |
| 35 | NC | NC | - | Ngwunye NC, njikwa oke |
| 36 | GND | GND | - | GND pin |
| 37 | AIO_01/TX0,（Udsleep） | I/O | VDDIO | UART0_TX, burn-in and general-purpose control pin |
| 38 | AIO_02/RX0,（Udsleep） | I/O | VDDIO | UART0_RX, burn-in and general-purpose control pins |
| 39 | AIO_03,（Udsleep） | I/O | VDDIO | AIO_03 |
| 40 | AIO_04,（Udsleep） | I/O | VDDIO | AIO_04 |
| 41 | MIO_05 | I/O | VDDIO | MIO_05 |
| 42 | NC | NC | - | Ngwunye NC, njikwa oke |
| 43 | GND | GND | - | GND pin |
| 44 | NC | NC | - | Ngwunye NC, njikwa oke |
GPIO ọtụtụ pin
The GPIO (General Purpose Input/Output) pins are shown in the table below.
Mara: The reuse signal 0 is the default function after the power-on reset is completed.
| Modul Ntụtụ | Ntụtụ mgbawa | Aha Pin | Ụdị ụdị | Ụgbọ ala (mA) | Voltage (V) | Nkọwa |
| 14 | 31 | MGPIO0 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0: MGPIO0 multiplexed signal 1: SDIO_D2 multiplexed signal 2-7: reservations Also multiplexed as an analog pin ADC_CH3 |
| 15 | 32 | MGPIO1/ AGPIO06 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0: MGPIO1 multiplexed signal 1: SDIO_D3 multiplexed signal 2-7: reservations |
| 16 | 33 | MGPIO2 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0: MGPIO2 multiplexed signal 1: SDIO_CMD multiplexed signal 2: SPI0_DI multiplexed signal 3~7: reservations |
| 17 | 34 | MGPIO3 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0: MGPIO3 multiplexed signal 1: SDIO_CLK multiplexed signal 2: SPI0_CLK multiplexed signal 3~7: reservations |
| 18 | 35 | MGPIO4 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO4 multiplexed signal 1：SDIO_D0 multiplexed signal 2：SPI0_DO multiplexed signal 3~7：reservations |
| 19 | 36 | AGPIO5 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：AGPIO5 multiplexed signal 1：SDIO_D1 multiplexed signal 2：SPI0_CS0 multiplexed signal 3~7: reservations |
| 41 | 5 | MGPIO5 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO5 multiplexed signal 1：UART_H1_TXD multiplexed signal 2~7：reservations Enwere ike ijikwa ya ọzọ dị ka ntụtụ analọgụ CLK_XOUT_32M |
| 21 | 28 | MGPIO6/ AGPIO00 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO6 multiplexed signal 1：UART_H0_RTS multiplexed signal 2：SPI0_DI multiplexed signal 3：WB_GLP_SYNC_PULSE multiplexed signal 4~7：reservations Can be reused as analog pinsADC_CH7 |
| 32 | 52 | MGPIO7/ AGPIO09 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO7 multiplexed signal 1：UART_H0_CTS multiplexed signal 2：SPI0_CS0 multiplexed signal 3：QSPI1_D2 multiplexed signal 4：reservations multiplexed signal 5：reservations multiplexed signal 6：ANT_SEL2 multiplexed signal 7：reservations |
| 4 | 26 | MGPIO8 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO8 multiplexed signal 1：UART_H0_TXD multiplexed signal 2：SPI0_CLK multiplexed signal 3：I2C1_SCL multiplexed signal 4~7：reservations Can be reused as analog pins ADC_CH5 |
| 11 | 27 | MGPIO9 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO9 multiplexed signal 1：UART_H0_RXD multiplexed signal 2：SPI0_DO multiplexed signal 3：I2C1_SDA multiplexed signal 4~7：reservations Multiplexable as analog tube ADC_CH6 |
| 8 | 21 | MGPIO10 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO10 multiplexed signal 1：SPI0_CS0 multiplexed signal 2：UART_H1_CTS multiplexed signal 3：reservations multiplexed signal 4：PWM0P multiplexed signal 5：I2S_WS multiplexed signal 6：ANT_SEL3 multiplexed signal 7：reservations |
| 5 | 22 | MGPIO11/ AGPIO07 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO11 multiplexed signal 1：SPI0_CLK multiplexed signal 2：UART_H1_RTS multiplexed signal 3：reservations multiplexed signal 4：PWM0N multiplexed signal 5：I2S_BCLK multiplexed signal 6~7： |
| 6 | 23 | MGPIO12 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO12 multiplexed signal 1：SPI0_DI multiplexed signal 2：UART_H1_TXD multiplexed signal 3：reservations multiplexed signal 4：reservations multiplexed signal 5：I2S_DI multiplexed signal 6：ANT_SEL4 multiplexed signal 7：reservations |
| 7 | 24 | MGPIO13 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO13 multiplexed signal 1：SPI0_DO multiplexed signal 2：UART_H1_RXD multiplexed signal 3：I2C0_SCL multiplexed signal 4：reservations multiplexed signal 5：I2S_DO multiplexed signal 6~7：reservations |
| 10 | 25 | MGPIO14 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO14 multiplexed signal 1：SPWM1N multiplexed signal 2：I2C0_SDA multiplexed signal 3：WB_GLP_SYNC_PULSE multiplexed signal 4：BT_ACTIVE multiplexed signal 5：UART_H0_CTS multiplexed signal 6：reservations multiplexed signal 7：reservations |
| 13 | 30 | MGPIO15 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO15 multiplexed signal 1：SPWM1P multiplexed signal 2：BT_STATUS multiplexed signal 3：UART_H1_RTS multiplexed signal 4：reservations multiplexed signal 5：reservations multiplexed signal 6：reservations multiplexed signal 7：reservations |
| 34 | 47 | MGPIO16/ AGPIO08 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO16 multiplexed signal 1：QSPI1_D3 multiplexed signal 2：PWM3N multiplexed signal 3~7： |
| 27 | 48 | MGPIO17 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO17 multiplexed signal 1：QSPI1_CLK multiplexed signal 2：UART_H0_TXD multiplexed signal 3：I2S_BCLK multiplexed signal 4：reservations multiplexed signal 5：BT_ACTIVE multiplexed signal 6~7：reservations |
| 28 | 49 | MGPIO18 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO18 multiplexed signal 1：QSPI1_D0 multiplexed signal 2：UART_H0_RXD multiplexed signal 3：I2S_DO multiplexed signal 4：WB_GLP_SYC_PULSE multiplexed signal 5：BT_STATUS multiplexed signal 6~7：reservations |
| 29 | 50 | MGPIO19 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO19 multiplexed signal 1：QSPI1_D1 multiplexed signal 2：PWM2P multiplexed signal 3：I2S_DI multiplexed signal 4：reservations multiplexed signal 5：BT_FREQ multiplexed signal 6~7： |
| 30 | 51 | MGPIO20 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO20 multiplexed signal 1：QSPI1_CS multiplexed signal 2：PWM2N multiplexed signal 3：I2S_WS multiplexed signal 4：reservations multiplexed signal 5：WLAN_ACTIVE multiplexed signal 6~7：reservations |
| 26 | 46 | MGPIO21 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO21 multiplexed signal 1：PWM0P multiplexed signal 2：UART_H0_RTS multiplexed signal 3：I2C0_SCL multiplexed signal 4：WB_GLP_SYNC_PULSE multiplexed signal 5：BT_STATUS multiplexed signal 6~7：reservations |
| 23 | 43 | MGPIO22 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：MGPIO22 multiplexed signal 1：PWM3P multiplexed signal 2：UART_H1_CTS multiplexed signal 3：I2C0_SDA multiplexed signal 4：reservations multiplexed signal 5：WLAN_ACTIVE multiplexed signal 6：ANT_SEL5 multiplexed signal 7：reservations Enwere ike ijikwa ya ọzọ dị ka ntụtụ analọgụ ADC_CH4 |
| 37 | 1 | AGPIO1 | ISPU/O | nhazi | 3.3/1.8 | multiplexed signal 0：AGPIO1 multiplexed signal 1：UART_L0_TXD multiplexed signal 2~7：reservations Enwere ike ijikwa ya ọzọ dị ka ntụtụ analọgụ ADC_CH0 |
| 38 | 2 | AGPIO2 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：AGPIO2 multiplexed signal 1：UART_L0_RXD multiplexed signal 2：PWM0P multiplexed signal 3~7：reservations |
| 39 | 3 | AGPIO3 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：AGPIO3 multiplexed signal 1：I2C1_SCL multiplexed signal 2：PWM0N multiplexed signal 3~7：reservations Enwere ike ijikwa ya ọzọ dị ka ntụtụ analọgụ ADC_CH1 |
| 40 | 4 | AGPIO4 | ISPU/ O | nhazi | 3.3/1.8 | multiplexed signal 0：AGPIO4 multiplexed signal 1：I2C1_SDA multiplexed signal 2：UART_H1_RXD multiplexed signal 3~7：reservations Enwere ike ijikwa ya ọzọ dị ka ntụtụ analọgụ ADC_CH2 |
| 25 | 45 | RTC_IN | ISPU/O | nhazi | 3.3/1.8 | |
| 24 | 44 | RTC_OUT | ISPU/ O | nhazi | 3.3/1.8 | |
| 12 | RST_N | ISPU/O | nhazi | 3.3/1.8 | Mgbama nrụpụta zuru ụwa ọnụ |
Nkọwa ụdị pin I/O: ISPU/O = Bidirectional, ntinye ntinye na mkpalite Schmitt.
Recommitting Conditions
| Oke | Min | Ụdị | Oke | Nkeji |
| VBAT & VDDIO = 3.3V | 3.16 | 3.30 | 3.46 | V |
| VDDIO = 1.8V | 1.71 | 1.80 | 1.89 | V |
| VBAT+VDDIO=3.3V Working Current | - | 350 | 500 | mA |
| VDDIO=3.3 or 1.8V Working Current | - | 50 | 150 | mA |
| Okpomọkụ arụ ọrụ | -20 | 70 | ℃ |
Nkọwapụta oriri ugbu a
| Oke | Nwale ihe | Ike TX | Ugbu a | Nkeji |
|
WiFi TX |
11b, CCK,1Mbps | 19mBm | 430 | mA |
| 11b, CCK,11Mbps | 19mBm | 420 | mA | |
| 11g, OFDM, 6Mbps | 19mBm | 320 | mA | |
| 11g, OFDM, 54Mbps | 19mBm | 200 | mA | |
| 11n,HT20,MCS0 | 19mBm | 310 | mA | |
| 11n,HT20,MCS7 | 18mBm | 200 | mA | |
| 11ax,HE20, MCS0 | 20mBm | 320 | mA | |
| 11ax,HE20, MCS9 | 16mBm | 180 | mA | |
| 11n,HT40,MCS0 | 19mBm | 310 | mA | |
| 11n,HT40,MCS7 | 18mBm | 180 | mA | |
| WiFi Stop TX | 0mBm | 25 | mA | |
| WiFi RX | - | - | 45 | mA |
| WiFi Kwụsị RX | 25 | mA | ||
| BT TX | BLE,1M, | 14mBm | 90 | mA |
| BLE,2M | 14mBm | 65 | mA | |
| BLE Stop TX | 0mBm | 20 | mA | |
| BT RX | - | - | 25 | mA |
| BLE Kwụsị RX | 20 | |||
Njirimara RF
WiFi 2.4G launch indicators
| Oke | Nwale ihe | Uru a na-ahụkarị |
| Ike mmepụta | 11b, 1Mbps | 17±2dBm,EVM<-20dB |
| 11b,11Mbps | 17±2dBm,EVM<-18dB | |
| 11g , 6Mbps | 17±2dBm,EVM<-20dB | |
| 11g , 54Mbps | 17±2dBm,EVM<-28dB | |
| 11n, HT20 MCS0 | 17±2dBm,EVM<-20dB | |
| 11n, HT20 MCS7 | 17±2dBm,EVM<-29dB | |
| 11ax,HT20 MSC0 | 18±2dBm,EVM<-22dB | |
| 11ax,HT20 MSC9 | 18±2dBm,EVM<-34dB | |
| Nwale ihe | Uru a na-ahụkarị | |
| 11n, HT40 MCS0 | 18±2dB,EVM<-20dB | |
| 11n, HT40 MCS7 | 18±2dB,EVM<-29dB |
Njirimara onye nnata WLAN
| Oke | Nwale ihe | CH3 | CH7 | CH11 | Nkeji |
| Nata Mmetụta | 11b, 1M , <-76dBm@8%PER | -98 | -98 | -98 | dBm |
| 11b, 11M ,<-76dBm@8%PER | -90 | -90 | -90 | dBm | |
| 11g, 6M , <-82dBm@10%PER | -95 | -95 | -95 | dBm | |
| 11g, 54M , <-65dBm@10%PER | -76 | -76 | -76 | dBm | |
| 11n, HT20 MCS0, <-82dBm@10% kwa | -94 | -94 | -94 | dBm | |
| 11n, HT20 MCS7, <-64dBm@10% kwa | -74 | -74 | -74 | dBm | |
| 11ax, HE20 MCS0, <-82dBm@10%PER | -94 | -94 | -94 | dBm | |
| 11ax, HE20 MCS9, <-57dBm@10%PER | -68 | -68 | -68 | dBm | |
| Nwale ihe | CH3 | CH7 | CH11 | Nkeji | |
| 11n, HT40 MCS0,<-79dBm@10%PER | -91 | -91 | -91 | dBm | |
| 11n, HT40 MCS7,<-61dBm@10%PER | -71 | -71 | -71 | dBm |
BLE TX Performance
| Oke | Nwale ihe | Uru a na-ahụkarị |
| Ike mmepụta | 1M | 12 ± 2dB |
| Ike mmepụta | 2M | 12 ± 2dB |
Mara: There is no commission certification requirement, compared to the typical value of the maximum power, there is a 4dB power reduction for the 2402M and 2478M channels and a 10dB power reduction for the 2480M channel.
BLE RX Performance
| Oke | Nwale ihe | Uru a na-ahụkarị | Ọwa | Nkeji | ||
| CH1 | CH19 | CH39 | ||||
| Sensitivity >30% packet | 1M | <-96 | -98 | -98 | -98 | dBm |
| Sensitivity >30% packet | 2M | <-93 | -95 | -95 | -95 | dBm |
Ozi ịtụ
| Modul | Nọmba akụkụ | Nkọwa |
| H353 | H353_NS | H353 WiFi/BLE Module without Shield |
| H353 | H353_WS | H353 WiFi/BLE Module with Shield |
- Usoro nrụgharị na-enweghị ndu chọrọ
Usoro ire ere na-enweghị ụzọ profile egosiri n'okpuru.
- Egosiri usoro ntugharị na-enweghị ndu na tebụl dị n'okpuru.
shore oge kpo oku Ọnụ ọgụgụ kasị elu okpomọkụ cooling rate warm-up area（40～150℃） 60 ruo 150s ≤2.0℃/s - - equal temperature zone（150～200℃ 60 ruo 120s 1.0 ℃ / s - - reflux zone（＞217℃） 60 ruo 90s - 230-260 ℃ - cooling zone（Tmax～180℃） - - - 1.0℃/s≤Mkpọda≤4.0℃/s
Nkọwa:
- Preheating zone: the temperature is from 40°C to 150°C, the temperature increase rate is controlled at about 2°C/s, the time of this temperature zone is 60-150s.
- average temperature zone: temperature from 150 °C to 200 °C, stable and slow warming, the temperature rise rate of less than 1 °C/s, and the time control in the region of 60~120s (Note: the region must be slowly heated, otherwise it is easy to lead to poor welding).
- reflux zone: temperature from 217°C to Tmax ~ 217°C, the time of the whole interval is controlled at 60-90s.
- Cooling zone: temperature from Tmax~180°C, the maximum temperature drop rate cannot exceed 4°C/s.
- Temperature increase from room temperature 25°C to 250°C should not take more than 6 minutes.
- The reflow profile bụ naanị nkwanye, onye ahịa kwesịrị imezi ya dịka ọnọdụ mmepụta ihe n'ezie.
The reflow time is targeted at 60 to 90s, and the reflow time can be relaxed to 120s for some veneer boards with large heat capacitance that cannot meet the time requirement.
Refer to IPC/JEDEC J-STD-020D for package temperature resistance standard, and refer to JEP 140 for package temperature measurement method.
IPC/JEDEC J-STD-020D standard, encapsulation body temperature measurement method in accordance with JEP 140 standard requirements:
The temperature resistance standards for lead-free device packages in IPC/JEDEC 020D are shown in the table below.
Tebụlụ IPC/JEDEC 020D Nkwekọrịta Nguzogide Ọnọdụ okpomọkụ maka ngwugwu ngwaọrụ na-enweghị isi
| Ọkpụrụkpụ ngwugwu | Olu mm3 .350 | Mpịakọta mm3 350 ~ 2000 | Olu mm3 ＞2000 |
| 1.6mm | 260 ℃ | 260 ℃ | 260 ℃ |
| 1.6mm na 2.5mm | 260 ℃ | 250 ℃ | 245 ℃ |
| 2.5mm | 250 ℃ | 245 ℃ | 245 ℃ |
Device solder ends (balls, pins) and external heat sinks are not accounted for in the volume calculations.
Reflow Soldering Process Profile Measurement Methods:
JEP140 Recommendations: For smaller thickness devices, measure the package temperature by directly placing a thermocouple on the surface of the device, and for larger thickness devices, drill and bury a thermocouple in the surface of the device for measurement. Due to the requirement of quantifying the thickness of the device, it is recommended that all the thermocouples are drilled and embedded on the surface of the package (except for particularly thin devices, which cannot be drilled)
Nkwupụta FCC
Ngwaọrụ a na-akwado akụkụ 15 nke iwu FCC. Ọrụ dị n'okpuru ọnọdụ abụọ ndị a: (1) ngwaọrụ a nwere ike ọ gaghị ebute nnyonye anya na-emerụ ahụ, yana (2) ngwaọrụ a ga-anabatarịrị nnyonye anya ọ bụla enwetara, gụnyere nnyonye anya nwere ike bute ọrụ na-achọghị.
Mgbanwe ma ọ bụ mgbanwe na-akwadoghị nke ọma site n'aka ndị na-ahụ maka nnabata nwere ike imebi ikike onye ọrụ iji rụọ ọrụ ahụ.
IHE: A nwalere ngwa a wee hụ na ọ dabara na oke maka ngwaọrụ dijitalụ Klas B, dịka akụkụ 15 nke Iwu FCC. Emebere oke ndị a iji nye nchebe ezi uche dị na ya megide nnyonye anya na-emerụ emerụ na ntinye ụlọ. Akụrụngwa a na-ewepụta ojiji ma nwee ike ịgbasa ike ugboro redio ma ọ bụrụ na etinyeghị ya ma jiri ya dịka ntuziaka siri dị, nwere ike ibute ndabichi na-emerụ ahụ na nkwukọrịta redio. Agbanyeghị, enweghị nkwa na nnyonye anya agaghị eme na otu nrụnye. Ọ bụrụ na akụrụngwa a na-ebute nnyonye anya na-emerụ ahụ na nnabata redio ma ọ bụ telivishọn, nke enwere ike ikpebi site na ịgbanyụ ma gbanye akụrụngwa, a na-agba onye ọrụ ume ka ọ nwaa idozi nnyonye anya site na otu ma ọ bụ karịa n'ime usoro ndị a:
- Megharịa ma ọ bụ bugharịa antenna nnata.
- Mee ka nkewa dị n'etiti akụrụngwa na nnata.
- Jikọọ akụrụngwa n'ime oghere na sekit dị iche na nke ejikọrọ onye nnata.
- Kpọtụrụ onye na-ere ahịa ma ọ bụ onye ọrụ redio/TV nwere ahụmahụ maka enyemaka ọkwa dị mkpa
Ihe ndetu dị mkpa:
Nkwupụta Mkpughe Radiation
Ngwa a na-akwado oke ikpughe radieshon FCC nke edobere maka gburugburu ebe anaghị achịkwa ya. Ekwesịrị ịwụnye akụrụngwa a ma rụọ ọrụ ya na anya kacha nta 20cm n'etiti radiator na ahụ gị.
Agaghị ejikọta ihe nnyefe a ma ọ bụ na-arụ ọrụ na njikọ antenna ma ọ bụ nnyefe ọ bụla ọzọ.
A ga-enwe nkwarụ njirimara nhọrọ koodu obodo maka ngwaahịa ndị ahịa na US/Canada.
Ezubere ngwaọrụ a naanị maka ndị nrụpụta OEM n'okpuru ọnọdụ ndị a:
- Ekwesịrị itinye antenna ahụ ka edobere 20 cm n'etiti antenna na ndị ọrụ, yana
- Modul nnyefe ahụ nwere ike ọ gaghị ejikọta ya na onye na-ebugharị ma ọ bụ antenna ọ bụla ọzọ,
- Maka ahịa niile na US, OEM ga-amachi ọwa ọrụ na CH1 ruo CH11 maka band 2.4G site na ngwa mmemme ngwa ngwa. OEM agaghị enye onye ọrụ njedebe ihe ọ bụla ma ọ bụ ozi ọ bụla gbasara mgbanwe nchịkwa nchịkwa. (ọ bụrụ na modular naanị nwalee Channel 1-11)
Ọ bụrụhaala na emezuru ọnọdụ atọ a dị n'elu, a gaghị achọ nyocha ọzọ nke nnyefe. Agbanyeghị, onye nrụpụta OEM ka na-ahụ maka ịnwale ngwaahịa njedebe ha maka nrube isi ọ bụla achọrọ na modul a arụnyere.
Ihe ndetu dị mkpa:
Ọ bụrụ na enweghị ike imezu ọnọdụ ndị a (maka exampụfọdụ nhazi laptọọpụ ma ọ bụ ọnọdụ ya na onye na-ebufe ọzọ), mgbe ahụ, ikike FCC agaghịzi ewere na ọ dị irè yana enweghị ike iji ID FCC na ngwaahịa ikpeazụ. N'ọnọdụ ndị a, onye ntinye OEM ga-ahụ maka nyochaghachi ngwaahịa njedebe (gụnyere onye na-ebugharị) na ịnweta ikike FCC dị iche.
Kwụsị ntinye aha ngwaahịa
The final end product must be labeled in a visible area with the following” Contains FCC ID: 2AXX8-H353-NS”
Ozi ntuziaka nye onye ọrụ njedebe
Onye mmekọ OEM kwesịrị ịma ka ọ ghara inye onye ọrụ njedebe ozi gbasara otu esi etinye ma ọ bụ wepu modul RF a na ntuziaka onye ọrụ nke ngwaahịa ngwụcha nke jikọtara modul a.
Akwụkwọ ntuziaka njedebe ga-agụnye ozi/ịdọ aka ná ntị usoro iwu niile achọrọ dị ka egosiri n'akwụkwọ ntuziaka a.
Ntuziaka njikọta maka ndị na-emepụta ngwaahịa nnabata dị ka KDB 996369 D03 OEM ntuziaka v01r01 si dị.
2.2 Ndepụta nke iwu FCC dị
CFR 47 FCC PART 15 SUBPART C enyochala. Ọ na-adabara na modul transmitter
2.3 Ọnọdụ eji arụ ọrụ akọwapụtara
Modul a bụ modular kwụụrụ naanị ya. Ọ bụrụ na ngwaahịa njedebe ga-agụnye ọnọdụ Multiple n'otu oge na-ebufe ma ọ bụ ọnọdụ ọrụ dị iche iche maka onye na-ebunye modular naanị ya na onye ọbịa, onye na-emepụta ụlọ ga-akpọtụrụ onye na-emepụta modul maka usoro ntinye na njedebe usoro.
Usoro modul 2.4 nwere oke
Ọ metụtaghị
2.5 trace antennas designs
Ọ metụtaghị
2.6 RF echiche mkpughe
Ngwa a na-akwado oke ikpughe radieshon FCC nke edobere maka gburugburu ebe anaghị achịkwa ya. Ekwesịrị ịwụnye akụrụngwa a ma rụọ ọrụ ya na opekempe 20cm n'etiti radiator na ahụ gị.
2.7 Antenna
This radio transmitter FCC ID:2AXX8-H353-NS has been approved by Federal Communications Commission to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.
| Antenna No. | Nọmba nlereanya nke antenna: | Ụdị antenna: | Nweta nke antenna (Max.) | Oke ugboro: | |
| Antenna 1 | Antenna 2 | ||||
| Bluetooth | / | Antenna mpụga | 4.55 | / | 2402-2480MHz |
| Wi-Fi 2.4G | / | Antenna mpụga | 4.55 | / | 2412-2462MHz |
2.8 Labelụ na ozi nnabata
A ghaghị ịkpọ ngwaahịa ikpeazụ ikpeazụ n'ebe a na-ahụ anya yana ihe ndị a" nwere FCC ID: 2AXX8-H353-NS".
2.9 Ozi na ụdị ule na ihe nnwale ndị ọzọ chọrọ
A na-atụ aro onye nrụpụta onye ọbịa ka ọ kwado nnabata nke FCC chọrọ maka onye na-ebufe mgbe etinyere modul na onye ọbịa.
2.10 Nnwale agbakwunyere, Nkebi nke 15 Nkebi nke B
Onye nrụpụta ndị ọbịa na-ahụ maka nnabata nke sistemu nnabata yana modul arụnyere yana ihe niile achọrọ maka sistemụ dị ka akụkụ 15 B.
2.11 Rụba ama echiche EMI
A na-atụ aro imepụta ndị ọbịa ka iji D04 Module Integration Guide na-atụ aro dị ka “omume kacha mma” RF imewe nnwale na nleba anya ma ọ bụrụ na mmekọrịta na-abụghị nke linear na-ewepụta oke na-akwadoghị n'ihi ntinye modul iji kwado akụrụngwa ma ọ bụ akụrụngwa.
2.12 Otu esi eme mgbanwe
Modul a bụ modular kwụụrụ naanị ya. Ọ bụrụ na ngwaahịa njedebe ga-agụnye ọnọdụ Multiple n'otu oge na-ebufe ma ọ bụ ọnọdụ ọrụ dị iche iche maka onye na-ebunye modular naanị ya na onye ọbịa, onye na-emepụta ụlọ ga-akpọtụrụ onye na-emepụta modul maka usoro ntinye na njedebe usoro. Dị ka KDB 996369 D02 Q&A Q12 si kwuo, na ụlọ ọrụ na-emepụta ihe kwesịrị ime nyocha (ya bụ, ọ dịghị C2PC chọrọ ma ọ bụrụ na ọnweghị ikuku gafere oke nke ngwaọrụ ọ bụla (gụnyere radiators n'amaghị ama) dị ka ihe mejupụtara. Onye nrụpụta ga-edozi ihe ọ bụla. ọdịda.
Akwụkwọ / akụrụngwa
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VLink H353 WiFi BLE Module [pdf] Akwụkwọ ntuziaka onye nwe H353, H353 WiFi BLE Module, WiFi BLE Module, BLE Module, modul |